JPS5056347A - - Google Patents
Info
- Publication number
- JPS5056347A JPS5056347A JP10501073A JP10501073A JPS5056347A JP S5056347 A JPS5056347 A JP S5056347A JP 10501073 A JP10501073 A JP 10501073A JP 10501073 A JP10501073 A JP 10501073A JP S5056347 A JPS5056347 A JP S5056347A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10501073A JPS529540B2 (en]) | 1973-09-19 | 1973-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10501073A JPS529540B2 (en]) | 1973-09-19 | 1973-09-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5056347A true JPS5056347A (en]) | 1975-05-17 |
| JPS529540B2 JPS529540B2 (en]) | 1977-03-16 |
Family
ID=14396089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10501073A Expired JPS529540B2 (en]) | 1973-09-19 | 1973-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS529540B2 (en]) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5762866A (en) * | 1993-02-22 | 1998-06-09 | Lucent Technologies Inc. | Article comprising a Pb-free solder having improved mechanical properties |
| US6824039B2 (en) * | 2002-03-26 | 2004-11-30 | Institute Of High Performance Computing | Lead free tin based solder composition |
| JP2006255784A (ja) * | 2004-11-24 | 2006-09-28 | Nittetsu Micro Metal:Kk | 無鉛ハンダ合金 |
| CN108994479A (zh) * | 2018-08-24 | 2018-12-14 | 温州市星峰新材料有限公司 | 一种耐腐蚀高强度的焊接材料及其制备方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6360357U (en]) * | 1986-10-04 | 1988-04-21 | ||
| JPS6377769U (en]) * | 1986-11-07 | 1988-05-23 |
-
1973
- 1973-09-19 JP JP10501073A patent/JPS529540B2/ja not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5762866A (en) * | 1993-02-22 | 1998-06-09 | Lucent Technologies Inc. | Article comprising a Pb-free solder having improved mechanical properties |
| US6824039B2 (en) * | 2002-03-26 | 2004-11-30 | Institute Of High Performance Computing | Lead free tin based solder composition |
| JP2006255784A (ja) * | 2004-11-24 | 2006-09-28 | Nittetsu Micro Metal:Kk | 無鉛ハンダ合金 |
| CN108994479A (zh) * | 2018-08-24 | 2018-12-14 | 温州市星峰新材料有限公司 | 一种耐腐蚀高强度的焊接材料及其制备方法 |
| CN108994479B (zh) * | 2018-08-24 | 2020-08-07 | 温州市星峰新材料有限公司 | 一种耐腐蚀高强度的焊接材料及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS529540B2 (en]) | 1977-03-16 |